Connecting technology
Our range
- Wiring carriers in thin and thick-film technology or based on PCB with dimensions adapted to the specific application conditions
- Detectors / emitters including evaluation electronics
- Precise mounting of detector and emitter chips (selection of chips according to spectral and geometric requirements of the respective application)
- Radiation-proof assembly of optical components (filters, grids, lenses)
- Potting of semiconductor chips (optical quality)
- Assembly and connection technology: Chip assembly, bonding, SMD mounting, hermetic sealing / welding of TO packages in a protective gas atmosphere
We manufacture customized optoelectronic components and assemblies. We are happy to advise you on the use and application of the right components. Please contact us directly with your tasks or the distributors responsible for your region.
